• iQ-Therm L15

    Article No. 023901

    iQ-Therm L15

    Button Energie Effizienz Zulassung-23.15-1735
    0239 | iQ-Therm L15
    Packaging unit

    Product specifications

    The stated values represent typical product characteristics and are not to be construed as binding product specifications.

    Field of application

    • For use on walls indoors and ceilings
    • Mould control and prevention in existing buildings
    • Implementation of the hygienic minimum heat insulation level in existing buildings
    • Improving the room climate by increasing the wall surface temperature
    • Compensation of thermal bridging effects in ceiling and wall connection areas
    • Optical correction of butt joints


    • EG_SCH_29
    • EG_SCH_31
    • Low construction height
    • Easy to work
    • EG_SCH_28
    • Preparation
      • Substrate requirements

        The substrate must be clean and capable of bearing a load.

        The substrate must be level.

      • Preparations

        Level off and even out highly uneven substrates – use SP Levell to seal joints and even out surfaces.

    • Application
      • Jigsaw / Cutter
      • Application temperature: min. 5 °C
      • Pre-wet the substrate.



        Position and press on the boards from the bottom up.

        Align using a floating rule.

    • Application instructions
      • Mark the desired dimensions on the board.

        Cut using a keyhole saw or hand-held circular saw.

        Rework the cut edges with a rasp or file if necessary.


        Make sure that full-surface bonding is achieved.

    • Storage / shelf life
      • Store frost-free / close containers
      • Dry and frost-free.

    • General information
      • Deviations from applicable regulations must be agreed separately.

    • Disposal instructions
      • The product must be disposed of in accordance with the official regulations.