Article No. 024114
The stated values represent typical product characteristics and are not to be construed as binding product specifications.
The substrate must be clean and capable of bearing a load.
The substrate must be level.
Level off and even out highly uneven substrates – use SP Levell to seal joints and even out surfaces.
Pre-wet the substrate.
Position and press on the boards from the bottom up.
Align using a floating rule.
Mark the desired dimensions on the board.
Cut using a keyhole saw or hand-held circular saw.
Rework the cut edges with a rasp or file if necessary.
Avoid cross joints.
Make sure that full-surface bonding is achieved.
Dry and frost-free.
Deviations from applicable regulations must be agreed separately.
The product must be disposed of in accordance with the official regulations.